Tuesday, 10 July 2018

Temperature Sensor Market | APAC to dominate market during forecast period (2018-2023)

The temperature sensor market is estimated to grow from USD 5.62 Billion in 2018 to USD 7.48 Billion by 2023, at a CAGR of 5.9% between 2018 and 2023. The growth of this market can be attributed to the increasing penetration of temperature sensors in advanced and portable healthcare equipment.

 
This report segments the temperature sensor market by product type, end-user industry, and region. By product type, the temperature sensor market has been segmented into contact-type temperature sensor and noncontact-type temperature sensor. The market for contact-type temperature sensor is expected to grow at a higher CAGR between 2018 and 2023 owing to the various advantages of these sensors, such as easy handling, increased throughput rates, fast response time, high flexibility, and prolonged service life.

Temperature sensors are used in personal computers mainly for controlling and monitoring the temperature of CPU. Generally, 3–5 temperature sensor ICs are used in desktops and laptops. As computers/desktops and laptops are vulnerable to overheating, measuring and controlling temperature is of utmost importance. Hence, personal computers (PCs) have contributed significantly to the growth of the temperature sensor market. However, the introduction of smartphones and tablets has impacted the shipment of PCs. Hence, the declining trend of the PC market has adversely affected the growth of the temperature sensor market.

The temperature sensor market in APAC is expected to grow at the highest CAGR during the forecast period. APAC has strong demand for consumer equipment, including portable healthcare electronics and white goods. In addition, the increasing industrial automation, especially in automotive and food & beverages sectors, will generate more demand for temperature sensors in APAC.

Major players in the temperature sensor market are ABB (Switzerland), Texas Instruments (US), Analog Devices (US), Honeywell International (US), Amphenol (US), Global Mixed Mode Technology (Taiwan), Integrated Device Technology (US), Kongsberg Gruppen (Norway), Microchip Technology (US), ON Semiconductor (US), Endress+Hauser (Switzerland), Okazaki Manufacturing Company (Japan), Yamari Industries (Japan), STMicroelectronics (Switzerland), TE Connectivity (Switzerland), Gunther GmbH Temperaturmesstechnik (Germany), and Omega Engineering (US).

 
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