The interposer and fan-out WLP market has entered the growth phase and is expected to be valued at USD 13.42 Billion in 2022, growing at a CAGR of 28.09% between 2016 and 2022. The major factors driving the growth of the market include rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of advanced wafer level packaging technologies in MEMS and sensors.
The major players operating in the interposer and fan-out WLP market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), Qualcomm Incorporated (U.S.), Texas Instruments (U.S.), United Microelectronics Corp. (Taiwan), STMicroelectronics NV (Switzerland), Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changing Electronics Technology Co., Ltd. (China), and Infineon Technologies AG (Germany).
The market for through-silicon vias (TSVs) is expected to grow at a high rate between 2016 and 2022. The major factors driving the growth of the interposer and fan-out WLP market for TSVs include high interconnect density and space efficiencies. Also, the compact structure of TSVs has led to the increase in its demand for use in various smart technologies, including wearable and connected devices.
The market for memory applications is expected to grow at a high rate between 2016 and 2022. The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions. In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.
Among all the major end-user industries, the consumer electronics industry accounted the largest share of the interposer and fan-out WLP market in 2015. The growth of the market for the consumer electronics is mainly driven by the increasing demand for smartphones, tablets, and other portable computing devices, which can be developed using advanced packaging to provide small form factors and improved performance at relatively lower cost.
APAC accounted for the largest share of the interposer and fan-out WLP market in 2015. The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.
Thermal-related issues due to higher level of integration are the major retraining factor for the growth of the interposer and fan-out WLP market.
Taiwan Semiconductor Manufacturing Company Limited (Taiwan) is one of the leading companies operating in the interposer and fan-out WLP market, followed by Samsung Electronics Co., Ltd. (South Korea) that provides advanced packages consisting fan-out WLP and TSV integration to address the need for high-performance and miniaturized products. Companies in the market are strengthening their product portfolio by launching new launches and investing more in R&D; they are increasingly undertaking partnerships and collaborations to develop new technologies.
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