The interposer and fan-out WLP market has entered the
growth phase and is expected to be valued at USD 13.42 Billion in 2022,
growing at a CAGR of 28.09% between 2016 and 2022. The major factors
driving the growth of the market include rising trend of miniaturization
of electronics devices; increasing demand for advanced architecture in
smartphones, tablets, and gaming devices; and increased usage of
advanced wafer level packaging technologies in MEMS and sensors.
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The market for through-silicon vias (TSVs) is
expected to grow at a high rate between 2016 and 2022. The major factors
driving the growth of the interposer and fan-out WLP market for TSVs
include high interconnect density and space efficiencies. Also, the
compact structure of TSVs has led to the increase in its demand for use
in various smart technologies, including wearable and connected devices.
TSV is one of the most compact package types with increased
functionality. TSV has gained popularity in space-constrained mobile
applications and is used in portable consumer devices as well as
industrial products as it is a cost-effective, compact, lightweight, and
high-performing semiconductor. The rising demand for advanced memory
packages such as flash and hybrid memory, image sensors, and others in
the consumer electronics industry is driving the growth of this market.
The use of interposer and fan-out WLP is expected to
provide a cost-effective solution and drive the wide-scale adoption of
this technology in potential end products. The average number of stacked
dice in memory modules is likely to grow with the increasing usage of
interposers. Moreover, innovations in advanced data storage such as
flash memory, hybrid memory cube, and so on are creating a demand for
interposer and fan-out WLP to develop high-performing compact memory
solutions.
In addition, the advent of complex device designs has brought
new challenges in interconnections such as need for higher I/O density
and performance requirements, which are efficiently addressed by
interposer and fan-out WLP.lectronics Co., Ltd. (South Korea), Toshiba Corp.
(Japan), ASE Group (Taiwan), Amkor Technology (U.S.), Qualcomm
Incorporated (U.S.), Texas Instruments (U.S.), United Microelectronics
Corp. (Taiwan), STMicroelectronics NV (Switzerland), Broadcom Ltd.
(Singapore), Intel Corporation. (U.S.), Jiangsu Changing Electronics
Technology Co., Ltd. (China), and Infineon Technologies AG (Germany).
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