Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan) and Samsung Electronics Co., Ltd. (South Korea) are the Leading Players in the Interposer and Fan-Out WLP Market

The interposer and fan-out WLP market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022. The key opportunities for this market include the increasing adoption of high-end computing, servers, and data centers and rising government initiatives. Some of the key factors driving the growth of the interposer and fan-out wafer-level packaging market include the rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of interposers and FOWLP technology in MEMS and sensors.

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The key players operating in the interposer and fan-out WLP market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), Advanced Semiconductor Engineering Group, (Taiwan), and Amkor Technology (U.S.). Most of the leading companies have adopted organic strategies, such as new product developments and launches, and inorganic strategies, such as partnerships and collaborations, to grow in the market. These leading strategies help companies to remain competitive in the market.

Leading players in the interposer and fan-out WLP market:

Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan) is a leader in the interposer and fan-out WLP market because of its wide parent market share contribution and technical expertise. The company has strong brand recognition worldwide, and it is one of the leading providers of semiconductor components. With huge R&D investments, the company focuses on the development of advanced packaging. It invested approximately USD 2.06 billion in R&D in 2015 and USD 2.21 billion in 2016. Its InFo PoP technology has been successfully qualified for advanced mobile considering the latest IC packaging. In March 2016, the company collaborated with Cadence Design Systems, Inc. (US), a leading company involved in the designing and development of integrated circuits and electronic devices, to drive the integrated design flow in 3D modeling. In December 2013, the company released the reference design for 16nm FinFET design flows and 3D-stalked ICs with silicon, leading the development of future advanced architecture. The company has future R&D plans and projects for 2017, which are dedicated toward the development of advanced packaging technologies for higher integration. 

Samsung Electronics Co., Ltd. (South Korea) ranked second in the market in 2015. Its R&D is expected to set new trends in the advanced packaging market. In August 2015, the company launched three-dimensional (3D) vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid-state drives (SSDs), and started the mass production of the first analyzed TSV technology-based DDR4 modules for enterprise servers. Also in August 2014, the company started the mass production of the first analyzed TSV technology-based DDR4 modules for enterprise servers. The company has strong financial power and invests heavily in R&D for consistent inventions. The company follows multidimensional business approach with both backward and forward integration. 

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Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power)- Global Forecast to 2022

According to the new research report "Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022", the interposer and fan-out WLP market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022. The growth of this market is mainly driven by the rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of advanced wafer level packaging technologies in MEMS and sensors.

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The major objectives of the study are as follows:

• To define, describe, and forecast the overall interposer and fan-out wafer-level packaging (FOWLP) market on the basis of application, packaging technology, end-user industry, and region
• To forecast the size of the market segments with respect to four main regions—North America (NA), Europe, Asia Pacific (APAC), and Rest of the World (RoW)
• To provide detailed information regarding the key factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
• To strategically analyze the micromarkets with respect to individual growth trends, future prospects, and contribution to the total market
• To analyze the opportunities in the market for stakeholders by identifying the high-growth segments of the interposer and fan-out wafer-level packaging (FOWLP) market
• To strategically profile the key players and comprehensively analyze their market position in terms of ranking and core competencies, along with detailing the competitive landscape for market leaders
• To analyze the strategic developments such as new product launches and related developments, acquisitions, expansions, and agreements in the interposer and fan-out wafer-level packaging (FOWLP) market

TSV is one of the most compact package types with increased functionality. TSV has gained popularity in space-constrained mobile applications and is used in portable consumer devices as well as industrial products as it is a cost-effective, compact, lightweight, and high-performing semiconductor. The rising demand for advanced memory packages such as flash and hybrid memory, image sensors, and others in the consumer electronics industry is driving the growth of this market.

The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions. In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.

APAC accounted for the largest share of the interposer and fan-out WLP market in 2015

The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

The major players operating in the interposer and fan-out WLP market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), Qualcomm Incorporated (U.S.), Texas Instruments (U.S.), United Microelectronics Corp. (Taiwan), STMicroelectronics NV (Switzerland), Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changing Electronics Technology Co., Ltd. (China), and Infineon Technologies AG (Germany).

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MarketsandMarkets™ provides quantified B2B research on 30,000 high growth niche opportunities/threats which will impact 70% to 80% of worldwide companies’ revenues. Currently servicing 5000 customers worldwide including 80% of global Fortune 1000 companies as clients. Almost 75,000 top officers across eight industries worldwide approach MarketsandMarkets™ for their painpoints around revenues decisions.

Our 850 fulltime analyst and SMEs at MarketsandMarkets™ are tracking global high growth markets following the "Growth Engagement Model – GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors. MarketsandMarkets™ now coming up with 1,500 MicroQuadrants (Positioning top players across leaders, emerging companies, innovators, strategic players) annually in high growth emerging segments. MarketsandMarkets™ is determined to benefit more than 10,000 companies this year for their revenue planning and help them take their innovations/disruptions early to the market by providing them research ahead of the curve.

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