According to the new research report "Interposer and Fan-Out WLP Market
by Application (Logic, Imaging & Optoelectronics, Memory,
MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and
Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022",
the interposer and fan-out WLP market is expected to be valued at USD
13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and
2022. The growth of this market is mainly driven by the rising trend of
miniaturization of electronics devices; increasing demand for advanced
architecture in smartphones, tablets, and gaming devices; and increased
usage of advanced wafer level packaging technologies in MEMS and
sensors.
The market for through-silicon vias (TSVs) is
expected to grow at a high rate between 2016 and 2022. The major factors
driving the growth of the interposer and fan-out WLP market for TSVs
include high interconnect density and space efficiencies. Also, the
compact structure of TSVs has led to the increase in its demand for use
in various smart technologies, including wearable and connected devices.
Download PDF Brochure:-
https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=130599842
https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=130599842
The market for memory applications is expected to
grow at a high rate between 2016 and 2022. The use of interposer and
fan-out WLP is expected to provide a cost-effective solution and drive
the wide-scale adoption of this technology in potential end products.
The average number of stacked dice in memory modules is likely to grow
with the increasing usage of interposers. Moreover, innovations in
advanced data storage such as flash memory, hybrid memory cube, and so
on are creating a demand for interposer and fan-out WLP to develop
high-performing compact memory solutions. In addition, the advent of
complex device designs has brought new challenges in interconnections
such as need for higher I/O density and performance requirements, which
are efficiently addressed by interposer and fan-out WLP.
Among all the major end-user industries, the consumer
electronics industry accounted the largest share of the interposer and
fan-out WLP market in 2015. The growth of the market for the consumer
electronics is mainly driven by the increasing demand for smartphones,
tablets, and other portable computing devices, which can be developed
using advanced packaging to provide small form factors and improved
performance at relatively lower cost.
APAC accounted for the largest share of the
interposer and fan-out WLP market in 2015. The major factors driving the
growth of the market in APAC include the presence of major
semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan);
proximity to major downstream electronics manufacturing operations;
government-sponsored infrastructure support; tax incentives; and
availability of skilled engineers and labor at a relatively low cost.
Thermal-related issues due to higher level of
integration are the major retraining factor for the growth of the
interposer and fan-out WLP market.
Taiwan Semiconductor Manufacturing Company Limited
(Taiwan) is one of the leading companies operating in the interposer and
fan-out WLP market, followed by Samsung Electronics Co., Ltd. (South
Korea) that provides advanced packages consisting fan-out WLP and TSV
integration to address the need for high-performance and miniaturized
products. Companies in the market are strengthening their product
portfolio by launching new launches and investing more in R&D; they
are increasingly undertaking partnerships and collaborations to develop
new technologies.
About MarketsandMarkets™
MarketsandMarkets™
provides quantified B2B research on 30,000 high growth niche
opportunities/threats which will impact 70% to 80% of worldwide
companies’ revenues. Currently servicing 7500 customers worldwide
including 80% of global Fortune 1000 companies as clients. Almost 75,000
top officers across eight industries worldwide approach
MarketsandMarkets™ for their painpoints around revenues decisions.
Our
850 fulltime analyst and SMEs at MarketsandMarkets™ are tracking global
high growth markets following the "Growth Engagement Model – GEM". The
GEM aims at proactive collaboration with the clients to identify new
opportunities, identify most important customers, write "Attack, avoid
and defend" strategies, identify sources of incremental revenues for
both the company and its competitors. MarketsandMarkets™ now coming up
with 1,500 MicroQuadrants (Positioning top players across leaders,
emerging companies, innovators, strategic players) annually in high
growth emerging segments. MarketsandMarkets™ is determined to benefit
more than 10,000 companies this year for their revenue planning and help
them take their innovations/disruptions early to the market by
providing them research ahead of the curve.
MarketsandMarkets’s
flagship competitive intelligence and market research platform,
"Knowledgestore" connects over 200,000 markets and entire value chains
for deeper understanding of the unmet insights along with market sizing
and forecasts of niche markets.
Contact:Mr. Shelly Singh
MarketsandMarkets™ INC.
630 Dundee Road
Suite 430
Northbrook, IL 60062
USA : 1-888-600-6441
No comments:
Post a Comment