According to the MarketsandMarkets forecast, the RF
power semiconductor market size, in terms of value, is expected to grow
from USD 10.57 Billion in 2015 to USD 31.26 Billion by 2022, at a CAGR
of 15.4% between 2016 and 2022. The rapid growth of the smartphone
market, increased use of LTE, and increased use of RF power for lighting
applications are factors that help drive the RF power semiconductor
market.
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The RF power amplifiers are expected to hold the
largest market share and dominate the RF power semiconductor market
between 2016 and 2022 owing to the increasing adoption of power
amplifiers across the globe. The growing preference for wireless
connectivity has driven the use of RF power devices in wireless
connectivity. The RF power amplifiers have applications in sectors such
as aerospace & defense, automotive, medical, telecommunication and
data communication, and consumer among others.
The consumer application is expected to hold the
largest market share and dominate the RF power semiconductor market
between 2016 and 2022. The growing use of smartphones and demand for
faster data rates are the major drivers for the RF power semiconductor
market in the consumer sector. The growth of LTE is also one of the
major drivers for the growth of the RF power semiconductor market.
APAC is expected to hold the largest market share and
dominate the RF power semiconductor market between 2016 and 2022. The
established electronics industry and adoption of innovative technologies
are the reasons for the high growth rate in the region. The RF power
semiconductor market in Asia-Pacific is expected to grow at a high rate
in consumer, telecommunication and data communication, and medical
sectors among others. The increasing number of players in the region is
further expected to drive the growth of the APAC RF power semiconductor
market.
The key players in RF power semiconductor market
include Infineon Technologies AG (Germany), M/A-COM Technology Solutions
Holdings, Inc. (U.S.), NXP Semiconductors N.V. (Netherlands), Qorvo,
Inc. (U.S.), Broadcom Limited (U.S.), Toshiba Corporation (Japan),
Qualcomm Inc. (U.S.), Skyworks Solutions, Inc. (U.S.), Mitsubishi
Electric Corporation (Japan), and Murata Manufacturing (Japan).
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