Tuesday 20 February 2018

Thermoelectric modules market for the deep cooling modules is expected to grow at a higher CAGR

The thermoelectric modules market is expected to grow from USD 527.5 Million in 2017 and is expected to reach USD 890.6 Million by 2023, at a CAGR of 9.12% between 2017 and 2023. The demand for thermoelectric modules is mainly driven by its superior advantages such as precise temperature control, compact geometric size, reliable solid state operations, lower power consumption, rapid temperature cycling, fully reversible switch in polarity, integrated design, and rapid response time.

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This report covers the thermoelectric modules market based on technology, type, functionality, end-use application, offering, and region. Currently, the telecommunications application dominates the global market and is expected to be a lead the market during the forecast period. This growth is attributed to the wide deployment of thermoelectric modules in the telecommunications applications such as optical channel monitors (OCM), community antenna television (CATV) lasers, transmission lasers (DWDM), avalanche photodiodes (APD), pump lasers (EDFA), and photonic integrated circuits (PIC).

The deep cooling modules are estimated to hold the largest share, and grow at a higher CAGR between 2017 and 2023. This growth is attributed to the increasing use of deep cooling modules in various applications such as infrared (IR) detectors, charged couple discharge (CCD) arrays, electro-optics industrial cooling, temperature control, water coolers (chillers), and cold chambers for climatic tests of radio electronic components.

The market for the software and services offering is expected to grow at a higher rate between 2017 and 2023. The increasing adoption of the software and services offering is due to the emergence of various companies offering simulation, designing and engineering, and testing and compliance software and services in the market. For instance, Laird (UK) offers AZTEC thermoelectric module simulation software. Moreover, some software help in providing solutions to thermoelectric module cooling assembly design issues. For instance, TECCad software offered by RMT Ltd. (Russia) aids in addressing and resolving thermoelectric modules assembly design issues.

 
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