According to MarketsandMarkets research "Radiation-Hardened Electronics Market with COVID-19 impact, by Component (Analog & Digital Mixed Signals, Memory & Processors, Controllers, Power Devices), Manufacturing Technique, Application, Product Type, and Geography) - Global Forecast to 2026", The market for radiation-hardened electronics was valued at USD 1.4 billion in 2020 and is estimated to reach USD 1.7 billion by 2026, registering a CAGR of 3.5% during the forecast period (2020–2026). The growing intelligence, surveillance, and reconnaissance (ISR) operations globally, the increase in number of space missions, and growing demand for rad-hard electronics in the commercial satellite industry are factors driving the growth of the rad-hard electronics market.
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Drivers : Increasing intelligence, surveillance, and reconnaissance (ISR) operations globally
Intelligence, surveillance, and reconnaissance (ISR) operations are increasing day by day in the defense industry to stay one step ahead of enemies and allies. Any ISR operation can be successful if high-quality, reliable, and environmentally acceptable end products are used. Hence, the latest processors, controllers, and electronic equipment are preferred for space, maritime, and military applications during ISR operations. Especially for space operations, the electronic equipment needs to survive highly challenging environments for an average of 15 years without any degradation in its performance and power. Radiation-hardened electronic components are accommodating the needs of these ISR operations in both commercial & military applications.
Restraints : High costs of development and designing
There are concerns regarding the high costs associated with radiation-hardened electronic components. Due to their less production & sales volume and long development cycles, these costs remained high throughout, which has reduced the competition between the key players in the global radiation-hardened electronics marketplace. Due to all these factors, there are very few technologies developed in the past few years, especially in the power devices segment. Hence, this factor may restrain the growth of the radiation-hardened electronics market in the coming years.
Radiation Hardening by Design (RHBD) Manufacturing Technique is expected to grow at a higher CAGR during the forecast period
The radiation hardening by design (RHBD) segment is expected to grow at the highest rate in the radiation-hardened electronics market attributed to the low cost per chip, high volume of production, and ease of modification. The RHBD memories, microcontrollers, and ASICs are mostly used in the defense and space industries as well as nuclear power plants. The market for RHBD designs is accentuated during COVID-19 because RHBD allows easy modifications by various government programs depending on the intended applications. Though radiation hardening by process (RHBP) is an effective approach for the manufacturing of radiation-hardened electronics systems, its adoption rate among the microelectronics manufacturers is less mainly because of the low profits, process uncertainties, and the high cost of manufacturing.
North America accounted for the largest share of the global radiation-hardened electronics market.
The growth in North America is attributed to the large presence of leading companies such as Honeywell Aerospace & Defense (US), Microchip Technology (US), and Xilinx, Inc. (US) and renowned space research institutes such as the National Aeronautics and Space Administration (NASA), the Florida Space Research Institute (FSRI), and Keck Institute for Space Studies (KISS). Most of the rad-hard components (nearly 50%) are supplied by the US to several parts of the world, and despite the stagnant economic growth and DoD budget costs, the demand for radiation-hardened electronics products is expected to remain high owing to various space missions and military operations being conducted worldwide. On the other hand, Europe is also expected to represent promising opportunities for the rad-hard component manufacturers during the forecast period. The market in APAC is expected to register the highest CAGR in the rad-hard market. With cutting-edge manufacturing technological abilities and improving economic conditions in China, India, and Japan, the region is expected to witness high growth in the coming years.
Bae Systems (UK), STMicroelectronics (Switzerland), Microchip technology (US), Renesas Electronics (Japan), Honeywell Aerospace & Defense (US), and Infineon Technologies (Germany) are the key players in the global Radiation-Hardened Electronics Market.
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