The interposer and fan-out WLP market is expected to be valued at USD
13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and
2022. The key opportunities for this market include the increasing
adoption of high-end computing, servers, and data centers and rising
government initiatives. Some of the key factors driving the growth of
the interposer and fan-out wafer-level packaging market include the
rising trend of miniaturization of electronics devices; increasing
demand for advanced architecture in smartphones, tablets, and gaming
devices; and increased usage of interposers and FOWLP technology in MEMS
and sensors.
• Request for Sample Pages:-
https://www.marketsandmarkets.com/requestsample.asp?id=130599842
About MarketsandMarkets™
MarketsandMarkets™ provides quantified B2B research on 30,000 high growth niche opportunities/threats which will impact 70% to 80% of worldwide companies’ revenues. Currently servicing 7500 customers worldwide including 80% of global Fortune 1000 companies as clients. Almost 75,000 top officers across eight industries worldwide approach MarketsandMarkets™ for their painpoints around revenues decisions.
Our 850 fulltime analyst and SMEs at MarketsandMarkets™ are tracking global high growth markets following the "Growth Engagement Model – GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors. MarketsandMarkets™ now coming up with 1,500 MicroQuadrants (Positioning top players across leaders, emerging companies, innovators, strategic players) annually in high growth emerging segments. MarketsandMarkets™ is determined to benefit more than 10,000 companies this year for their revenue planning and help them take their innovations/disruptions early to the market by providing them research ahead of the curve.
MarketsandMarkets’s flagship competitive intelligence and market research platform, "Knowledgestore" connects over 200,000 markets and entire value chains for deeper understanding of the unmet insights along with market sizing and forecasts of niche markets.
Contact:
Mr. Shelly Singh
MarketsandMarkets™ INC.
630 Dundee Road
Suite 430
Northbrook, IL 60062
USA : 1-888-600-6441
• Request for Sample Pages:-
https://www.marketsandmarkets.com/requestsample.asp?id=130599842
The key players operating in the interposer
and fan-out WLP market include Taiwan Semiconductor Manufacturing
Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea),
Toshiba Corp. (Japan), Advanced Semiconductor Engineering Group,
(Taiwan), and Amkor Technology (U.S.). Most of the leading companies
have adopted organic strategies, such as new product developments and
launches, and inorganic strategies, such as partnerships and
collaborations, to grow in the market. These leading strategies help
companies to remain competitive in the market.
Leading players in the interposer and fan-out WLP market:
Taiwan Semiconductor Manufacturing Company Ltd.
(Taiwan) is a leader in the interposer and fan-out WLP market because of
its wide parent market share contribution and technical expertise. The
company has strong brand recognition worldwide, and it is one of the
leading providers of semiconductor components. With huge R&D
investments, the company focuses on the development of advanced
packaging. It invested approximately USD 2.06 billion in R&D in 2015
and USD 2.21 billion in 2016. Its InFo PoP technology has been
successfully qualified for advanced mobile considering the latest IC
packaging. In March 2016, the company collaborated with Cadence Design
Systems, Inc. (US), a leading company involved in the designing and
development of integrated circuits and electronic devices, to drive the
integrated design flow in 3D modeling. In December 2013, the company
released the reference design for 16nm FinFET design flows and
3D-stalked ICs with silicon, leading the development of future advanced
architecture. The company has future R&D plans and projects for
2017, which are dedicated toward the development of advanced packaging
technologies for higher integration.
Samsung Electronics Co., Ltd. (South Korea) ranked
second in the market in 2015. Its R&D is expected to set new trends
in the advanced packaging market. In August 2015, the company launched
three-dimensional (3D) vertical NAND (V-NAND) flash memory based on 48
layers of 3-bit multi-level-cell (MLC) arrays for use in solid-state
drives (SSDs), and started the mass production of the first analyzed TSV
technology-based DDR4 modules for enterprise servers. Also in August
2014, the company started the mass production of the first analyzed TSV
technology-based DDR4 modules for enterprise servers. The company has
strong financial power and invests heavily in R&D for consistent
inventions. The company follows multidimensional business approach with
both backward and forward integration.
MarketsandMarkets™ provides quantified B2B research on 30,000 high growth niche opportunities/threats which will impact 70% to 80% of worldwide companies’ revenues. Currently servicing 7500 customers worldwide including 80% of global Fortune 1000 companies as clients. Almost 75,000 top officers across eight industries worldwide approach MarketsandMarkets™ for their painpoints around revenues decisions.
Our 850 fulltime analyst and SMEs at MarketsandMarkets™ are tracking global high growth markets following the "Growth Engagement Model – GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors. MarketsandMarkets™ now coming up with 1,500 MicroQuadrants (Positioning top players across leaders, emerging companies, innovators, strategic players) annually in high growth emerging segments. MarketsandMarkets™ is determined to benefit more than 10,000 companies this year for their revenue planning and help them take their innovations/disruptions early to the market by providing them research ahead of the curve.
MarketsandMarkets’s flagship competitive intelligence and market research platform, "Knowledgestore" connects over 200,000 markets and entire value chains for deeper understanding of the unmet insights along with market sizing and forecasts of niche markets.
Contact:
Mr. Shelly Singh
MarketsandMarkets™ INC.
630 Dundee Road
Suite 430
Northbrook, IL 60062
USA : 1-888-600-6441
No comments:
Post a Comment