The interposer and fan-out WLP market has entered the
growth phase and is expected to be valued at USD 13.42 Billion in 2022,
growing at a CAGR of 28.09% between 2016 and 2022. The major factors
driving the growth of the market include rising trend of miniaturization
of electronics devices; increasing demand for advanced architecture in
smartphones, tablets, and gaming devices; and increased usage of
advanced wafer level packaging technologies in MEMS and sensors.
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The market for through-silicon vias (TSVs) is
expected to grow at a high rate between 2016 and 2022. The major factors
driving the growth of the interposer and fan-out WLP market for TSVs
include high interconnect density and space efficiencies. Also, the
compact structure of TSVs has led to the increase in its demand for use
in various smart technologies, including wearable and connected devices.
The market for memory applications is expected to
grow at a high rate between 2016 and 2022. The use of interposer and
fan-out WLP is expected to provide a cost-effective solution and drive
the wide-scale adoption of this technology in potential end products.
The average number of stacked dice in memory modules is likely to grow
with the increasing usage of interposers. Moreover, innovations in
advanced data storage such as flash memory, hybrid memory cube, and so
on are creating a demand for interposer and fan-out WLP to develop
high-performing compact memory solutions. In addition, the advent of
complex device designs has brought new challenges in interconnections
such as need for higher I/O density and performance requirements, which
are efficiently addressed by interposer and fan-out WLP.
Among all the major end-user industries, the consumer
electronics industry accounted the largest share of the interposer and
fan-out WLP market in 2015. The growth of the market for the consumer
electronics is mainly driven by the increasing demand for smartphones,
tablets, and other portable computing devices, which can be developed
using advanced packaging to provide small form factors and improved
performance at relatively lower cost.
Taiwan Semiconductor Manufacturing Company Limited
(Taiwan) is one of the leading companies operating in the interposer and
fan-out WLP market, followed by Samsung Electronics Co., Ltd. (South
Korea) that provides advanced packages consisting fan-out WLP and TSV
integration to address the need for high-performance and miniaturized
products. Companies in the market are strengthening their product
portfolio by launching new launches and investing more in R&D; they
are increasingly undertaking partnerships and collaborations to develop
new technologies.
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