The temperature sensor market was valued at USD 5.29
Billion in 2017 and is expected to reach USD 7.48 Billion by 2023, at a
CAGR of 5.9% during the forecast period. The base year considered for
the study is 2017, and the forecast period considered is 2018–2023.
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The
objective of the report is to provide a detailed analysis of the
temperature sensor market by product type, end-user industry, and
region. The report forecasts the market size, in terms of value, of
various segments with regard to 4 main regions North America, Europe,
APAC, and RoW. It strategically profiles the key players and
comprehensively analyzes their rankings and core competencies in the
temperature sensor market, and details the competitive landscape for
these market leaders.
Temperature sensors are used in personal computers
mainly for controlling and monitoring the temperature of CPU. Generally,
3–5 temperature sensor ICs are used in desktops and laptops. As
computers/desktops and laptops are vulnerable to overheating, measuring
and controlling temperature is of utmost importance. Hence, personal
computers (PCs) have contributed significantly to the growth of the
temperature sensor market. However, the introduction of smartphones and
tablets has impacted the shipment of PCs. Hence, the declining trend of
the PC market has adversely affected the growth of the temperature
sensor market.
The temperature sensor market in APAC is expected to
grow at the highest CAGR during the forecast period. APAC has strong
demand for consumer equipment, including portable healthcare electronics
and white goods. In addition, the increasing industrial automation,
especially in automotive and food & beverages sectors, will generate
more demand for temperature sensors in APAC.
Major players in the temperature sensor market are
ABB (Switzerland), Texas Instruments (US), Analog Devices (US),
Honeywell International (US), Amphenol (US), Global Mixed Mode
Technology (Taiwan), Integrated Device Technology (US), Kongsberg
Gruppen (Norway), Microchip Technology (US), ON Semiconductor (US),
Endress+Hauser (Switzerland), Okazaki Manufacturing Company (Japan),
Yamari Industries (Japan), STMicroelectronics (Switzerland), TE
Connectivity (Switzerland), Gunther GmbH Temperaturmesstechnik
(Germany), and Omega Engineering (US).
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