Interposer and Fan-Out WLP Market estimated to be worth 13.42 Billion USD by 2022

The global interposer and fan-out WLP market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022.

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The major objectives of the study are as follows:

• To define, describe, and forecast the overall interposer and fan-out wafer-level packaging (FOWLP) market on the basis of application, packaging technology, end-user industry, and region
• To forecast the size of the market segments with respect to four main regions—North America (NA), Europe, Asia Pacific (APAC), and Rest of the World (RoW)
• To provide detailed information regarding the key factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
• To strategically analyze the micromarkets with respect to individual growth trends, future prospects, and contribution to the total market
• To analyze the opportunities in the market for stakeholders by identifying the high-growth segments of the interposer and fan-out wafer-level packaging (FOWLP) market
• To strategically profile the key players and comprehensively analyze their market position in terms of ranking and core competencies, along with detailing the competitive landscape for market leaders
• To analyze the strategic developments such as new product launches and related developments, acquisitions, expansions, and agreements in the interposer and fan-out wafer-level packaging (FOWLP) market

The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

The major players operating in the interposer and fan-out WLP market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), Qualcomm Incorporated (U.S.), Texas Instruments (U.S.), United Microelectronics Corp. (Taiwan), STMicroelectronics NV (Switzerland), Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changing Electronics Technology Co., Ltd. (China), and Infineon Technologies AG (Germany).

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